Patent details

EP1245328 Title: Use of silver in a lead-free solder paset

Basic Information

Publication number:
EP1245328
PCT Application Number:
Type:
European Patent Granted for LU
Legal Status:
Lapsed
Application number:
EP014005342
PCT Publication Number:
First applicant's nationality:
Translation Language:
EPO Publication Language:
English
English Title of Invention:
Use of silver in a lead-free solder paset
French Title of Invention:
Usage d'Argent dans une p^te de brasage sans plomb
German Title of Invention:
Verwendung von Silber in einer bleifreien Lötpaste
SPC Number:

Dates

Filing date:
01/03/2001
Grant date:
16/06/2010
EP Publication Date:
02/10/2002
PCT Publication Date:
Claims Translation Received Date:
Translations Received Date (B1 EP Publication):
Translations Received Date (B2 EP Publication):
Translations Received Date (B3 EP Publication):
Publication date:
02/10/2002
EP B1 Publication Date:
16/06/2010
EP B2 Publication Date:
20/12/2017
EP B3 Publication Date:
Lapsed date:
01/03/2011
Expiration date:
01/03/2021
Renunciation date:
Revocation date:
Annulment date:

Owner

From:
13/12/2017
 
 

Name:
SENJU METAL INDUSTRY CO., LTD.
Address:
23 Senju-Hashido-cho Adachi-ku, Tokyo, 120-8555, Japan (JP)

Inventor

1

Name:
Toyoda, Yoshitaka
Address:
Japan (JP)

2

Name:
Munekata, Osamu
Address:
Japan (JP)

3

Name:
Katoh, Rikiya
Address:
Japan (JP)

Classification

IPC classification:
B23K 35/26;

Publication

European Patent Bulletin

1

Issue number:
201751
Publication date:
20/12/2017
Description:
Title of invention Modified

2

Issue number:
201751
Publication date:
20/12/2017
Description:
Patent maintained (B2 publication)

3

Issue number:
201830
Publication date:
25/07/2018
Description:
Document reprinted after correction (B8, B9)
Filing date Document type Number of pages