Patent details
EP1245328
Title:
Use of silver in a lead-free solder paset
Basic Information
- Publication number:
- EP1245328
- PCT Application Number:
- Type:
- European Patent Granted for LU
- Legal Status:
- Lapsed
- Application number:
- EP014005342
- PCT Publication Number:
- First applicant's nationality:
- Translation Language:
- EPO Publication Language:
- English
- English Title of Invention:
- Use of silver in a lead-free solder paset
- French Title of Invention:
- Usage d'Argent dans une p^te de brasage sans plomb
- German Title of Invention:
- Verwendung von Silber in einer bleifreien Lötpaste
- SPC Number:
-
Dates
- Filing date:
- 01/03/2001
- Grant date:
- 16/06/2010
- EP Publication Date:
- 02/10/2002
- PCT Publication Date:
- Claims Translation Received Date:
- Translations Received Date (B1 EP Publication):
- Translations Received Date (B2 EP Publication):
- Translations Received Date (B3 EP Publication):
- Publication date:
- 02/10/2002
- EP B1 Publication Date:
- 16/06/2010
- EP B2 Publication Date:
- 20/12/2017
- EP B3 Publication Date:
- Lapsed date:
- 01/03/2011
- Expiration date:
- 01/03/2021
- Renunciation date:
- Revocation date:
- Annulment date:
Owner
- From:
- 13/12/2017
-
-
- Name:
- SENJU METAL INDUSTRY CO., LTD.
- Address:
- 23 Senju-Hashido-cho
Adachi-ku, Tokyo, 120-8555, Japan (JP)
Inventor
1
- Name:
- Toyoda, Yoshitaka
- Address:
- Japan (JP)
2
- Name:
- Munekata, Osamu
- Address:
- Japan (JP)
3
- Name:
- Katoh, Rikiya
- Address:
- Japan (JP)
Classification
- IPC classification:
-
B23K 35/26;
Publication
European Patent Bulletin
1
- Issue number:
- 201751
- Publication date:
- 20/12/2017
- Description:
- Title of invention Modified
2
- Issue number:
- 201751
- Publication date:
- 20/12/2017
- Description:
- Patent maintained (B2 publication)
3
- Issue number:
- 201830
- Publication date:
- 25/07/2018
- Description:
- Document reprinted after correction (B8, B9)
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