Patent details

EP2818526 Title: Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications

Basic Information

Publication number:
EP2818526
PCT Application Number:
Type:
European Patent Granted for LU
Legal Status:
Lapsed
Application number:
EP141747097
PCT Publication Number:
First applicant's nationality:
Translation Language:
EPO Publication Language:
English
English Title of Invention:
Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications
French Title of Invention:
Compositions de pâte de polissage chimique mécanique et procédé d'utilisation de celui-ci pour des applications d'interconnexion et de cuivre
German Title of Invention:
Zusammensetzung für chemisch-mechanisches Polieren und Verfahren damit für Kupfer- und Silicium-Durchkontaktierungsanwendungen
SPC Number:

Dates

Filing date:
27/06/2014
Grant date:
22/06/2016
EP Publication Date:
22/06/2016
PCT Publication Date:
Claims Translation Received Date:
Translations Received Date (B1 EP Publication):
Translations Received Date (B2 EP Publication):
Translations Received Date (B3 EP Publication):
Publication date:
31/12/2014
EP B1 Publication Date:
22/06/2016
EP B2 Publication Date:
EP B3 Publication Date:
Lapsed date:
27/06/2016
Expiration date:
27/06/2034
Renunciation date:
Revocation date:
Annulment date:

Owner

From:
27/06/2014
 
 

Name:
AIR PRODUCTS AND CHEMICALS INC.
Address:
7201 Hamilton Boulevard, Allentown, PA 18195-1501, United States (US)

Inventor

1

Name:
Shi Xiaobo
Address:
United States (US)

2

Name:
Murella Krishna P.
Address:
United States (US)

3

Name:
Schlueter James Allen
Address:
United States (US)

4

Name:
Choo Jae Ouk
Address:
United States (US)

Priority

Priority Number:
201313929346
Priority Date:
27/06/2013
Priority Country:
United States (US)

Classification

Main IPC Class:
C09G 1/02;

Annual Fees

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