Patent details

EP2714807 Title: COMPOSITION FOR METAL ELECTROPLATING COMPRISING AN ADDITIVE FOR BOTTOM-UP FILLING OF THOUGH SILICON VIAS AND INTERCONNECT FEATURES

Basic Information

Publication number:
EP2714807
PCT Application Number:
IB2012052727
Type:
European Patent Granted for LU
Legal Status:
Lapsed
Application number:
EP127920593
PCT Publication Number:
WO2012164509
First applicant's nationality:
Translation Language:
EPO Publication Language:
English
English Title of Invention:
COMPOSITION FOR METAL ELECTROPLATING COMPRISING AN ADDITIVE FOR BOTTOM-UP FILLING OF THOUGH SILICON VIAS AND INTERCONNECT FEATURES
French Title of Invention:
COMPOSITION POUR UN ÉLECTROPLAQUAGE MÉTALLIQUE COMPRENANT UN ADDITIF POUR UN REMPLISSAGE DE HAUT EN BAS DE TROUS TRAVERSANT LE SILICIUM ET CARACTÉRISTIQUES D'INTERCONNEXION
German Title of Invention:
ZUSAMMENSETZUNG ZUR METALLGALVANISIERUNG MIT EINEM ZUSATZSTOFF ZUR AUFFÜLLUNG DURCH SILICIUMDURCHGÄNGE UND VERBINDUNGSFUNKTIONEN
SPC Number:

Dates

Filing date:
31/05/2012
Grant date:
02/01/2019
EP Publication Date:
09/04/2014
PCT Publication Date:
06/12/2012
Claims Translation Received Date:
Translations Received Date (B1 EP Publication):
Translations Received Date (B2 EP Publication):
Translations Received Date (B3 EP Publication):
Publication date:
02/01/2019
EP B1 Publication Date:
02/01/2019
EP B2 Publication Date:
EP B3 Publication Date:
Lapsed date:
31/05/2019
Expiration date:
31/05/2032
Renunciation date:
Revocation date:
Annulment date:

Owner

From:
26/12/2018
 
 

Name:
BASF SE
Address:
Carl-Bosch-Strasse 38, 67056 Ludwigshafen am Rhein, Germany (DE)

Inventor

1

Name:
ARNOLD, Marco
Address:
Germany (DE)

2

Name:
RÖGER-GÖPFERT, Cornelia
Address:
Germany (DE)

3

Name:
MAYER, Dieter
Address:
Germany (DE)

4

Name:
FLÜGEL, Alexander
Address:
Germany (DE)

5

Name:
EMNET, Charlotte
Address:
Germany (DE)

6

Name:
RAETHER, Roman, Benedikt
Address:
Germany (DE)

Priority

Priority Number:
201161491935 P
Priority Date:
01/06/2011
Priority Country:
United States (US)

Classification

IPC classification:
C08G 73/02; C08L 79/02; C23C 18/38; C25D 3/38; C25D 7/12; H01L 21/288; H01L 21/768;

Publication

European Patent Bulletin

Issue number:
201901
Publication date:
02/01/2019
Description:
Grant (B1)

Annual Fees

Annual Fee Due Date:
Annual Fee Number:
Expected Payer:
Last Annual Fee Payment Date:
Last Annual Fee Paid Number:
Payer:
Filing date Document type Number of pages