Patent details

EP3249470 Title: STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES

Basic Information

Publication number:
EP3249470
PCT Application Number:
Type:
European Patent Granted for LU
Legal Status:
Lapsed
Application number:
EP171724982
PCT Publication Number:
First applicant's nationality:
Translation Language:
EPO Publication Language:
English
English Title of Invention:
STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES
French Title of Invention:
COMPOSITIONS DE DÉCAPAGE POUR L'ÉLIMINATION DE PHOTORÉSINES DE SUBSTRATS SEMI-CONDUCTEURS
German Title of Invention:
ABLÖSEZUSAMMENSETZUNGEN ZUR FOTOLACKENTFERNUNG VON HALBLEITERSUBSTRATEN
SPC Number:

Dates

Filing date:
23/05/2017
Grant date:
03/04/2019
EP Publication Date:
29/11/2017
PCT Publication Date:
Claims Translation Received Date:
Translations Received Date (B1 EP Publication):
Translations Received Date (B2 EP Publication):
Translations Received Date (B3 EP Publication):
Publication date:
03/04/2019
EP B1 Publication Date:
03/04/2019
EP B2 Publication Date:
EP B3 Publication Date:
Lapsed date:
23/05/2019
Expiration date:
23/05/2037
Renunciation date:
Revocation date:
Annulment date:

Owner

From:
27/03/2019
 
 

Name:
FUJIFILM Electronic Materials U.S.A, Inc.
Address:
80 Circuit Drive, North Kingstown RI 02852, United States (US)

Inventor

1

Name:
SUGISHIMA, Yasuo
Address:
United States (US)

2

Name:
MIZUTANI, Atsushi
Address:
Belgium (BE)

3

Name:
WOJTCZAK, William A.
Address:
United States (US)

Priority

Priority Number:
201662340204 P
Priority Date:
23/05/2016
Priority Country:
United States (US)

Classification

IPC classification:
C11D 7/10; C11D 7/26; C11D 7/32; C11D 7/50; G03F 7/42;

Publication

European Patent Bulletin

1

Issue number:
201914
Publication date:
03/04/2019
Description:
Grant (B1)

2

Issue number:
201919
Publication date:
08/05/2019
Description:
Application number/publication number of the divisional application (Art. 76) changed

Annual Fees

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Expected Payer:
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Payer:
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