Patent details
EP3249470
Title:
STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES
Basic Information
- Publication number:
- EP3249470
- PCT Application Number:
- Type:
- European Patent Granted for LU
- Legal Status:
- Lapsed
- Application number:
- EP171724982
- PCT Publication Number:
- First applicant's nationality:
- Translation Language:
- EPO Publication Language:
- English
- English Title of Invention:
- STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES
- French Title of Invention:
- COMPOSITIONS DE DÉCAPAGE POUR L'ÉLIMINATION DE PHOTORÉSINES DE SUBSTRATS SEMI-CONDUCTEURS
- German Title of Invention:
- ABLÖSEZUSAMMENSETZUNGEN ZUR FOTOLACKENTFERNUNG VON HALBLEITERSUBSTRATEN
- SPC Number:
-
Dates
- Filing date:
- 23/05/2017
- Grant date:
- 03/04/2019
- EP Publication Date:
- 29/11/2017
- PCT Publication Date:
- Claims Translation Received Date:
- Translations Received Date (B1 EP Publication):
- Translations Received Date (B2 EP Publication):
- Translations Received Date (B3 EP Publication):
- Publication date:
- 03/04/2019
- EP B1 Publication Date:
- 03/04/2019
- EP B2 Publication Date:
- EP B3 Publication Date:
- Lapsed date:
- 23/05/2019
- Expiration date:
- 23/05/2037
- Renunciation date:
- Revocation date:
- Annulment date:
Owner
- From:
- 27/03/2019
-
-
- Name:
- FUJIFILM Electronic Materials U.S.A, Inc.
- Address:
- 80 Circuit Drive, North Kingstown RI 02852, United States (US)
Inventor
1
- Name:
- SUGISHIMA, Yasuo
- Address:
- United States (US)
2
- Name:
- MIZUTANI, Atsushi
- Address:
- Belgium (BE)
3
- Name:
- WOJTCZAK, William A.
- Address:
- United States (US)
Priority
- Priority Number:
- 201662340204 P
- Priority Date:
- 23/05/2016
- Priority Country:
- United States (US)
Classification
- IPC classification:
-
C11D 7/10;
C11D 7/26;
C11D 7/32;
C11D 7/50;
G03F 7/42;
Publication
European Patent Bulletin
1
- Issue number:
- 201914
- Publication date:
- 03/04/2019
- Description:
- Grant (B1)
2
- Issue number:
- 201919
- Publication date:
- 08/05/2019
- Description:
- Application number/publication number of the divisional application (Art. 76) changed
Annual Fees
- Annual Fee Due Date:
-
- Annual Fee Number:
-
- Expected Payer:
-
- Last Annual Fee Payment Date:
-
- Last Annual Fee Paid Number:
-
- Payer:
-
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