Patent details

EP3275955 Title: ELECTRIC/ELECTRONIC PART AND BONDING METHOD

Basic Information

Publication number:
EP3275955
PCT Application Number:
JP2016000960
Type:
European Patent Granted for LU
Legal Status:
Lapsed
Application number:
EP167549948
PCT Publication Number:
WO2016136244
First applicant's nationality:
Translation Language:
EPO Publication Language:
English
English Title of Invention:
ELECTRIC/ELECTRONIC PART AND BONDING METHOD
French Title of Invention:
COMPOSANT ÉLECTRIQUE/ÉLECTRONIQUE ET PROCÉDÉ DE LIAISON
German Title of Invention:
ELEKTRISCHE/ELEKTRONISCHE KOMPONENT UND VERBINDUNGSVERFAHREN
SPC Number:

Dates

Filing date:
23/02/2016
Grant date:
27/05/2020
EP Publication Date:
31/01/2018
PCT Publication Date:
01/09/2016
Claims Translation Received Date:
Translations Received Date (B1 EP Publication):
Translations Received Date (B2 EP Publication):
Translations Received Date (B3 EP Publication):
Publication date:
27/05/2020
EP B1 Publication Date:
27/05/2020
EP B2 Publication Date:
EP B3 Publication Date:
Lapsed date:
23/02/2021
Expiration date:
23/02/2036
Renunciation date:
Revocation date:
Annulment date:

Owner

From:
20/05/2020
 
 

Name:
Dow Toray Co., Ltd.
Address:
2-24, Higashishinagawa 2-chome, Shinagawa-ku,, Tokyo, Japan (JP)

Inventor

1

Name:
YOSHIDA, Shin
Address:
Japan (JP)

2

Name:
YAMAZAKI, Ryosuke
Address:
Japan (JP)

3

Name:
YOSHIDA, Hiroaki
Address:
Japan (JP)

Priority

Priority Number:
2015037452
Priority Date:
26/02/2015
Priority Country:
Japan (JP)

Classification

IPC classification:
C09D 5/00; C09D 183/10; C09D 7/40;

Publication

European Patent Bulletin

Issue number:
202022
Publication date:
27/05/2020
Description:
Grant (B1)

Annual Fees

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