Patent details
EP2412020 Title: SLIP CHIP DEVICE AND METHODS
Basic Information
- Publication number:
- EP2412020
- PCT Application Number:
- US2010028316
- Type:
- European Patent Granted for LU
- Legal Status:
- Lapsed
- Application number:
- EP107567141
- PCT Publication Number:
- WO2010111265
- First applicant's nationality:
- Translation Language:
- EPO Publication Language:
- English
- English Title of Invention:
- SLIP CHIP DEVICE AND METHODS
- French Title of Invention:
- DISPOSITIF ET PROCÉDÉS DE PUCE COULISSANTE
- German Title of Invention:
- SCHIEBE- UND SCHNEIDEVORRICHTUNG UND ENTSPRECHENDE VERFAHREN
- SPC Number:
Dates
- Filing date:
- 23/03/2010
- Grant date:
- 30/09/2020
- EP Publication Date:
- 01/02/2012
- PCT Publication Date:
- 30/09/2010
- Claims Translation Received Date:
- Translations Received Date (B1 EP Publication):
- Translations Received Date (B2 EP Publication):
- Translations Received Date (B3 EP Publication):
- Publication date:
- 30/09/2020
- EP B1 Publication Date:
- 30/09/2020
- EP B2 Publication Date:
- EP B3 Publication Date:
- Lapsed date:
- 23/03/2021
- Expiration date:
- 23/03/2030
- Renunciation date:
- Revocation date:
- Annulment date:
Owner
- From:
- 23/09/2020
- Name:
- University Of Chicago
- Address:
- 5801 S. Ellis, Chicago, IL 60637, United States (US)
Inventor
1
- Name:
- SHEN, Feng
- Address:
- United States (US)
2
- Name:
- DU, Wenbin
- Address:
- China (CN)
3
- Name:
- ISMAGILOV, Rustem, F.
- Address:
- United States (US)
4
- Name:
- LI, Liang
- Address:
- United States (US)
5
- Name:
- NICHOLS, Kevin, Paul, Flood
- Address:
- United States (US)
6
- Name:
- KREUTZ, Jason, Eugene
- Address:
- United States (US)
7
- Name:
- CHEN, Delai
- Address:
- United States (US)
Priority
1
- Priority Number:
- 162922 P
- Priority Date:
- 24/03/2009
- Priority Country:
- United States (US)
2
- Priority Number:
- 262375 P
- Priority Date:
- 18/11/2009
- Priority Country:
- United States (US)
3
- Priority Number:
- 340872 P
- Priority Date:
- 22/03/2010
- Priority Country:
- United States (US)
Classification
- IPC classification:
- H01L 23/48;
Publication
European Patent Bulletin
- Issue number:
- 202040
- Publication date:
- 30/09/2020
- Description:
- Grant (B1)
Annual Fees
- Annual Fee Due Date:
- Annual Fee Number:
- Expected Payer:
- Last Annual Fee Payment Date:
- Last Annual Fee Paid Number:
- Payer:
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