Patent details
EP1929524 Title: MICROELECTRONIC DEVICE PACKAGES, AND STACKED MICROLECETRONIC DEVICE PACKAGES
Basic Information
- Publication number:
- EP1929524
- PCT Application Number:
- US2006033219
- Type:
- European Patent Granted for LU
- Legal Status:
- Lapsed
- Application number:
- EP068023175
- PCT Publication Number:
- WO2007025127
- First applicant's nationality:
- Translation Language:
- EPO Publication Language:
- English
- English Title of Invention:
- MICROELECTRONIC DEVICE PACKAGES, AND STACKED MICROLECETRONIC DEVICE PACKAGES
- French Title of Invention:
- BOITIERS DE DISPOSITIFS MICROELECTRONIQUES, ET EMPILAGES DE TELS BOITIERS
- German Title of Invention:
- VERKAPSELTE MIKROELEKTRONISCHE BAUELEMENTE UND GESTAPELTE VERKAPSELTE MIKROELEKTRONISCHE BAUELEMENTE
- SPC Number:
Dates
- Filing date:
- 25/08/2006
- Grant date:
- 07/11/2018
- EP Publication Date:
- 11/06/2008
- PCT Publication Date:
- 01/03/2007
- Claims Translation Received Date:
- Translations Received Date (B1 EP Publication):
- Translations Received Date (B2 EP Publication):
- Translations Received Date (B3 EP Publication):
- Publication date:
- 07/11/2018
- EP B1 Publication Date:
- 07/11/2018
- EP B2 Publication Date:
- EP B3 Publication Date:
- Lapsed date:
- 25/08/2019
- Expiration date:
- 25/08/2026
- Renunciation date:
- Revocation date:
- Annulment date:
Owner
- From:
- 31/10/2018
- Name:
- Micron Technology, Inc.
- Address:
- 8000 South Federal Way, P.O. Box 6, Boise, ID 93716-9632, United States (US)
Inventor
1
- Name:
- CHONG, Chin, Hui
- Address:
- Singapore (SG)
2
- Name:
- YE, Seng Kim Dalson
- Address:
- Singapore (SG)
Priority
1
- Priority Number:
- 200505523
- Priority Date:
- 26/08/2005
- Priority Country:
- Singapore (SG)
2
- Priority Number:
- 218028
- Priority Date:
- 31/08/2005
- Priority Country:
- United States (US)
Classification
- IPC classification:
- H01L 25/065; H01L 25/10;
Publication
European Patent Bulletin
- Issue number:
- 201845
- Publication date:
- 07/11/2018
- Description:
- Grant (B1)
Annual Fees
- Annual Fee Due Date:
- Annual Fee Number:
- Expected Payer:
- Last Annual Fee Payment Date:
- Last Annual Fee Paid Number:
- Payer:
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