Patent details

EP2504396 Title: COMPOSITION FOR COPPER ELECTROPLATING COMPRISING LEVELING AGENT

Basic Information

Publication number:
EP2504396
PCT Application Number:
EP2010067874
Type:
European Patent Granted for LU
Legal Status:
Lapsed
Application number:
EP107822629
PCT Publication Number:
WO2011064154
First applicant's nationality:
Translation Language:
EPO Publication Language:
English
English Title of Invention:
COMPOSITION FOR COPPER ELECTROPLATING COMPRISING LEVELING AGENT
French Title of Invention:
COMPOSITION POUR ÉLECTROPLAQUAGE DE CUIVRE COMPRENANT UN AGENT DE NIVELLEMENT
German Title of Invention:
ZUSAMMENSETZUNG ZUR KUPFERGALVANISIERUNG MIT VERLAUFMITTEL
SPC Number:

Dates

Filing date:
22/11/2010
Grant date:
24/02/2021
EP Publication Date:
03/10/2012
PCT Publication Date:
03/06/2011
Claims Translation Received Date:
Translations Received Date (B1 EP Publication):
Translations Received Date (B2 EP Publication):
Translations Received Date (B3 EP Publication):
Publication date:
24/02/2021
EP B1 Publication Date:
24/02/2021
EP B2 Publication Date:
EP B3 Publication Date:
Lapsed date:
22/11/2021
Expiration date:
22/11/2030
Renunciation date:
Revocation date:
Annulment date:

Owner

From:
17/02/2021
 
 

Name:
BASF SE
Address:
Carl-Bosch-Strasse 38, 67056 Ludwigshafen am Rhein, Germany (DE)

Inventor

1

Name:
RAETHER, Roman Benedikt
Address:
Germany (DE)

2

Name:
MAYER, Dieter
Address:
Germany (DE)

3

Name:
ARNOLD, Marco
Address:
Germany (DE)

4

Name:
RÖGER-GÖPFERT, Cornelia
Address:
Germany (DE)

5

Name:
EMNET, Charlotte
Address:
Germany (DE)

Priority

Priority Number:
264705 P
Priority Date:
27/11/2009
Priority Country:
United States (US)

Classification

IPC classification:
C08G 73/02; C08L 79/02; C25D 3/02; C25D 3/38; C25D 5/02; C25D 7/12; H01L 21/288; H01L 21/768; H05K 3/42;

Publication

European Patent Bulletin

Issue number:
202108
Publication date:
24/02/2021
Description:
Grant (B1)

Annual Fees

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