Patent details
EP2681766 Title: DISTRIBUTED BUILDING BLOCKS OF R-C CLAMPING CIRCUITRY IN SEMICONDUCTOR DIE CORE AREA
Basic Information
- Publication number:
- EP2681766
- PCT Application Number:
- US2012027337
- Type:
- European Patent Granted for LU
- Legal Status:
- Lapsed
- Application number:
- EP127154730
- PCT Publication Number:
- WO2012119003
- First applicant's nationality:
- Translation Language:
- EPO Publication Language:
- English
- English Title of Invention:
- DISTRIBUTED BUILDING BLOCKS OF R-C CLAMPING CIRCUITRY IN SEMICONDUCTOR DIE CORE AREA
- French Title of Invention:
- BLOCS DE CONSTRUCTION RÉPARTIS D'ÉLÉMENTS DE CIRCUIT DE FIXATION DE NIVEAU R-C DANS RÉGION CENTRALE DE PUCE SEMI-CONDUCTRICE
- German Title of Invention:
- VERTEILTE BAUSTEINE EINER R-C-KLEMMSCHALTUNG IN EINEM HALBLEITERPCHIPKERNBEREICH
- SPC Number:
Dates
- Filing date:
- 01/03/2012
- Grant date:
- 26/06/2019
- EP Publication Date:
- 08/01/2014
- PCT Publication Date:
- 07/09/2012
- Claims Translation Received Date:
- Translations Received Date (B1 EP Publication):
- Translations Received Date (B2 EP Publication):
- Translations Received Date (B3 EP Publication):
- Publication date:
- 26/06/2019
- EP B1 Publication Date:
- 26/06/2019
- EP B2 Publication Date:
- EP B3 Publication Date:
- Lapsed date:
- 01/03/2020
- Expiration date:
- 01/03/2032
- Renunciation date:
- Revocation date:
- Annulment date:
Owner
- From:
- 19/06/2019
- Name:
- Qualcomm Incorporated
- Address:
- 5775 Morehouse Drive, San Diego, CA 92121, United States (US)
Inventor
1
- Name:
- DUNDIGAL, Sreeker, R.
- Address:
- United States (US)
2
- Name:
- JALILIZEINALI, Reza
- Address:
- United States (US)
3
- Name:
- WORLEY, Eugene R.
- Address:
- United States (US)
4
- Name:
- SIANSURI, Evan
- Address:
- United States (US)
Priority
1
- Priority Number:
- 201161447760 P
- Priority Date:
- 01/03/2011
- Priority Country:
- United States (US)
2
- Priority Number:
- 201113173977
- Priority Date:
- 30/06/2011
- Priority Country:
- United States (US)
Classification
- IPC classification:
- H01L 27/02;
Publication
European Patent Bulletin
- Issue number:
- 201926
- Publication date:
- 26/06/2019
- Description:
- Grant (B1)
Annual Fees
- Annual Fee Due Date:
- Annual Fee Number:
- Expected Payer:
- Last Annual Fee Payment Date:
- Last Annual Fee Paid Number:
- Payer:
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