Patent details
EP2855157 Title: METHOD FOR BONDING A CHIP TO A SUBSTRATE
Basic Information
- Publication number:
- EP2855157
- PCT Application Number:
- EP2013060733
- Type:
- European Patent Granted for LU
- Legal Status:
- Lapsed
- Application number:
- EP137264750
- PCT Publication Number:
- WO2013174976
- First applicant's nationality:
- Translation Language:
- EPO Publication Language:
- English
- English Title of Invention:
- METHOD FOR BONDING A CHIP TO A SUBSTRATE
- French Title of Invention:
- PROCÉDÉ DE LIAISON D'UNE PUCE DANS UN SUBSTRAT
- German Title of Invention:
- VERFAHREN ZUM BONDEN EINES CHIPS IN EIN SUBSTRAT
- SPC Number:
Dates
- Filing date:
- 24/05/2013
- Grant date:
- 21/02/2018
- EP Publication Date:
- 08/04/2015
- PCT Publication Date:
- 28/11/2013
- Claims Translation Received Date:
- Translations Received Date (B1 EP Publication):
- Translations Received Date (B2 EP Publication):
- Translations Received Date (B3 EP Publication):
- Publication date:
- 21/02/2018
- EP B1 Publication Date:
- 21/02/2018
- EP B2 Publication Date:
- EP B3 Publication Date:
- Lapsed date:
- 24/05/2018
- Expiration date:
- 24/05/2033
- Renunciation date:
- Revocation date:
- Annulment date:
Owner
- From:
- 14/02/2018
- Name:
- OCE-Technologies B.V.
- Address:
- P.O. 101 St.Urbanusweg 43, 5914 CA Venlo, Netherlands (NL)
Inventor
- Name:
- LAMERS, Norbert, H., W.
- Address:
- Netherlands (NL)
Priority
- Priority Number:
- 12169330
- Priority Date:
- 24/05/2012
- Priority Country:
- European Patent Office (EPO) (EP)
Classification
- IPC classification:
- B41J 2/14;
Publication
European Patent Bulletin
- Issue number:
- 201808
- Publication date:
- 21/02/2018
- Description:
- Grant (B1)
Annual Fees
- Annual Fee Due Date:
- Annual Fee Number:
- Expected Payer:
- Last Annual Fee Payment Date:
- Last Annual Fee Paid Number:
- Payer:
| Filing date | Document type | Number of pages |
|---|---|---|
| 30/09/2018 | Outgoing Correspondence | 1 |