Patent details
EP2924737 Title: Semiconductor wafer, method for manufacturing light receiving sensor, and light receiving sensor
Basic Information
- Publication number:
- EP2924737
- PCT Application Number:
- Type:
- European Patent Granted for LU
- Legal Status:
- Lapsed
- Application number:
- EP151610466
- PCT Publication Number:
- First applicant's nationality:
- Translation Language:
- EPO Publication Language:
- English
- English Title of Invention:
- Semiconductor wafer, method for manufacturing light receiving sensor, and light receiving sensor
- French Title of Invention:
- TRANCHE DE SEMI-CONDUCTEUR, PROCÉDÉ DE FABRICATION D'UN CAPTEUR DE RÉCEPTION DE LUMIÈRE ET LEDIT CAPTEUR
- German Title of Invention:
- HALBLEITERWAFER, VERFAHREN ZUR HERSTELLUNG EINES LICHTEMPFANGSSENSORS UND LICHTEMPFANGSSENSOR
- SPC Number:
Dates
- Filing date:
- 26/03/2015
- Grant date:
- 07/12/2016
- EP Publication Date:
- 07/12/2016
- PCT Publication Date:
- Claims Translation Received Date:
- Translations Received Date (B1 EP Publication):
- Translations Received Date (B2 EP Publication):
- Translations Received Date (B3 EP Publication):
- Publication date:
- 30/09/2015
- EP B1 Publication Date:
- 07/12/2016
- EP B2 Publication Date:
- EP B3 Publication Date:
- Lapsed date:
- 26/03/2017
- Expiration date:
- 26/03/2035
- Renunciation date:
- Revocation date:
- Annulment date:
Owner
- From:
- 26/03/2015
- Name:
- Seiko Epson Corporation
- Address:
- 4-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0811, Japan (JP)
Inventor
1
- Name:
- Uematsu Akira
- Address:
- Japan (JP)
2
- Name:
- Matsuo Atsushi
- Address:
- Japan (JP)
Priority
- Priority Number:
- 2014067766
- Priority Date:
- 28/03/2014
- Priority Country:
- Japan (JP)
Classification
- Main IPC Class:
- H01L 27/146;
Annual Fees
- Annual Fee Due Date:
- Annual Fee Number:
- Expected Payer:
- Last Annual Fee Payment Date:
- Last Annual Fee Paid Number:
- Payer:
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