Patent details

Basic Information

Publication number:

EP1319254

PCT Application Number:

PCT/EP/2001/010029

Type:

European Patent Granted for LU

Legal Status:

Lapsed

Application number:

EP019719848

PCT Publication Number:

WO/2002/025742

First applicant's nationality:

Translation Language:

EPO Publication Language:

German

English Title of Invention:

Method for producing a semiconductor-metal contact through a dielectric layer

French Title of Invention:

Procédé de réalisation d'un contact semi-conducteur-metal par l'intermédiaire d'une couche diélectrique

German Title of Invention:

Verfahren zur Herstellung eines Halbleiter-Metallkontaktes durch eine dielektrische Schicht

SPC Number:

Dates

Filing date:

30/08/2001

Grant date:

12/07/2006

EP Publication Date:

12/07/2006

PCT Publication Date:

28/03/2002

Claims Translation Received Date:

Translations Received Date (B1 EP Publication):

Translations Received Date (B2 EP Publication):

Translations Received Date (B3 EP Publication):

Publication date:

18/06/2003

EP B1 Publication Date:

12/07/2006

EP B2 Publication Date:

EP B3 Publication Date:

Lapsed date:

30/08/2006

Expiration date:

30/08/2021

Renunciation date:

Revocation date:

Annulment date:

Owner

From:

21/12/2006

 

 

Name:

FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

Address:

HANSASTRASSE 27C, 80686 MÜNCHEN, Germany (DE)

Inventor

1

Name:

PREU Ralf

Address:

Germany (DE)

2

Name:

SCHNEIDERLÖCHNER Eric

Address:

Germany (DE)

3

Name:

GLUNZ Stefan

Address:

Germany (DE)

4

Name:

LÜDEMANN Ralf

Address:

Germany (DE)

Priority

Priority Number:

10046170

Priority Date:

19/09/2000

Priority Country:

Germany (DE)

Classification

Main IPC Class:

H01L 31/0224;

Filing date	Document type	Number of pages