Patent details

Basic Information

Publication number:

EP1501127

PCT Application Number:

Type:

European Patent Granted for LU

Legal Status:

Lapsed

Application number:

EP040144339

PCT Publication Number:

First applicant's nationality:

Translation Language:

EPO Publication Language:

German

English Title of Invention:

Method of manufacturing a power semiconductor module with a base plate having high bending stiffness

French Title of Invention:

Méthode de fabrication d'un module semiconducteur de puissance avec une plaque de support résistante à la flexion

German Title of Invention:

Verfahren zur Herstellung eines Leistungshalbleitermoduls mit biegesteifer Grundplatte

SPC Number:

Dates

Filing date:

19/06/2004

Grant date:

24/06/2009

EP Publication Date:

24/06/2009

PCT Publication Date:

Claims Translation Received Date:

Translations Received Date (B1 EP Publication):

Translations Received Date (B2 EP Publication):

Translations Received Date (B3 EP Publication):

Publication date:

26/01/2005

EP B1 Publication Date:

24/06/2009

EP B2 Publication Date:

EP B3 Publication Date:

Lapsed date:

19/06/2010

Expiration date:

19/06/2024

Renunciation date:

Revocation date:

Annulment date:

Owner

From:

19/06/2004

 

 

Name:

SEMIKRON Elektronik GmbH & Co. KG

Address:

Sigmundstrasse 200, 90431 Nürnberg, Germany (DE)

Inventor

1

Name:

Steger Jürgen

Address:

Germany (DE)

2

Name:

Jäger Harald

Address:

Germany (DE)

3

Name:

Rüger Herbert

Address:

Germany (DE)

4

Name:

Manz Yvonne

Address:

Germany (DE)

5

Name:

Matthes Jürgen

Address:

Germany (DE)

Priority

Priority Number:

10333329

Priority Date:

23/07/2003

Priority Country:

Germany (DE)

Classification

Main IPC Class:

H01L 25/07;

Filing date	Document type	Number of pages