Patent details

EP1510601 Title: Apparatus for electroplating wafers

Basic Information

Publication number:
EP1510601
PCT Application Number:
Type:
European Patent Granted for LU
Legal Status:
Lapsed
Application number:
EP040168338
PCT Publication Number:
First applicant's nationality:
Translation Language:
EPO Publication Language:
German
English Title of Invention:
Apparatus for electroplating wafers
French Title of Invention:
appareil de placage de wafer
German Title of Invention:
Scheibengalvanisiervorrichtung
SPC Number:

Dates

Filing date:
16/07/2004
Grant date:
01/03/2006
EP Publication Date:
01/03/2006
PCT Publication Date:
Claims Translation Received Date:
Translations Received Date (B1 EP Publication):
Translations Received Date (B2 EP Publication):
Translations Received Date (B3 EP Publication):
Publication date:
02/03/2005
EP B1 Publication Date:
01/03/2006
EP B2 Publication Date:
EP B3 Publication Date:
Lapsed date:
16/07/2006
Expiration date:
16/07/2024
Renunciation date:
Revocation date:
Annulment date:

Owner

From:
16/07/2004
 
 

Name:
Rena Sondermaschinen GmbH
Address:
Ob der Eck 5, 78148 Gütenbach, Germany (DE)

Inventor

1

Name:
Gutekunst Jürgen
Address:
Germany (DE)

2

Name:
Bojan Vasile-Adrian
Address:
Germany (DE)

Priority

Priority Number:
10333068
Priority Date:
19/07/2003
Priority Country:
Germany (DE)

Classification

Main IPC Class:
C25D 17/00;
Filing date Document type Number of pages