Patent details
EP1724050 Title: SOLDER PASTE
Basic Information
- Publication number:
- EP1724050
- PCT Application Number:
- PCT/JP/2004/003027
- Type:
- European Patent Granted for LU
- Legal Status:
- Lapsed
- Application number:
- EP047187265
- PCT Publication Number:
- WO/2005/084877
- First applicant's nationality:
- Translation Language:
- EPO Publication Language:
- Not available
- English Title of Invention:
- SOLDER PASTE
- French Title of Invention:
- PATE BRASER
- German Title of Invention:
- LÖTPASTE
- SPC Number:
Dates
- Filing date:
- 09/03/2004
- Grant date:
- 04/12/2013
- EP Publication Date:
- 09/01/2014
- PCT Publication Date:
- 15/09/0010
- Claims Translation Received Date:
- Translations Received Date (B1 EP Publication):
- Translations Received Date (B2 EP Publication):
- Translations Received Date (B3 EP Publication):
- Publication date:
- 22/11/2006
- EP B1 Publication Date:
- 04/12/2013
- EP B2 Publication Date:
- EP B3 Publication Date:
- Lapsed date:
- 09/03/2014
- Expiration date:
- 09/03/2024
- Renunciation date:
- Revocation date:
- Annulment date:
Owner
- From:
- 09/03/2004
- Name:
- SENJU METAL INDUSTRY CO. LTD.
- Address:
- 23 Senju-Hashido-cho Adachi-ku, Tokyo, 120-8555, Japan (JP)
Inventor
1
- Name:
- TAKAURA Kunihito
- Address:
- Japan (JP)
2
- Name:
- TAKAHASHI Hiroshi
- Address:
- Japan (JP)
3
- Name:
- KAWANAKAGO Hiroshi
- Address:
- Japan (JP)
4
- Name:
- TSURUTA Kaichi
- Address:
- Japan (JP)
Classification
- Main IPC Class:
- C22C 13/00;
| Filing date | Document type | Number of pages |
|---|