Patent details

EP2388355 Title: Resin plating method using graphene thin layer

Basic Information

Publication number:
EP2388355
PCT Application Number:
Type:
European Patent Granted for LU
Legal Status:
Lapsed
Application number:
EP111615019
PCT Publication Number:
First applicant's nationality:
Translation Language:
EPO Publication Language:
English
English Title of Invention:
Resin plating method using graphene thin layer
French Title of Invention:
Procédé de plaquage de résine utilisant une couche mince de graphène
German Title of Invention:
Harzbeschichtungsverfahren mit Graphendünnschicht
SPC Number:

Dates

Filing date:
07/04/2011
Grant date:
12/06/2013
EP Publication Date:
12/06/2013
PCT Publication Date:
Claims Translation Received Date:
Translations Received Date (B1 EP Publication):
Translations Received Date (B2 EP Publication):
Translations Received Date (B3 EP Publication):
Publication date:
23/11/2011
EP B1 Publication Date:
12/06/2013
EP B2 Publication Date:
EP B3 Publication Date:
Lapsed date:
07/04/2014
Expiration date:
07/04/2031
Renunciation date:
Revocation date:
Annulment date:

Owner

From:
07/04/2011
 
 

Name:
Samsung Electronics Co. Ltd.
Address:
129, Samsung-ro Yeongtong-gu, Suwon-si, Gyeonggi-do, 443-742, Korea (Republic) (KR)

Inventor

1

Name:
Son Sang Ik
Address:
Korea (Republic) (KR)

2

Name:
Oh Joon Suk
Address:
Korea (Republic) (KR)

3

Name:
Lee Jun Ho
Address:
Korea (Republic) (KR)

4

Name:
Nam Jae Do
Address:
Korea (Republic) (KR)

5

Name:
Hwang Tae Seon
Address:
Korea (Republic) (KR)

6

Name:
Bae Ah Hyun
Address:
Korea (Republic) (KR)

Priority

Priority Number:
20100046626
Priority Date:
18/05/2010
Priority Country:
Korea (Republic) (KR)

Classification

Main IPC Class:
C25D 5/10;
Filing date Document type Number of pages