Patent details

Basic Information

Publication number:

EP2883649

PCT Application Number:

JP2013070473

Type:

European Patent Granted for LU

Legal Status:

Lapsed

Application number:

EP138282108

PCT Publication Number:

WO2014024715

First applicant's nationality:

Translation Language:

EPO Publication Language:

English

English Title of Invention:

HIGH-TEMPERATURE LEAD-FREE SOLDER ALLOY

French Title of Invention:

ALLIAGE DE SOUDAGE SANS PLOMB À HAUTE TEMPÉRATURE

German Title of Invention:

BLEIFREIE HOCHTEMPERATURLÖTLEGIERUNG

SPC Number:

Dates

Filing date:

29/07/2013

Grant date:

19/04/2017

EP Publication Date:

17/06/2015

PCT Publication Date:

13/02/2014

Claims Translation Received Date:

Translations Received Date (B1 EP Publication):

Translations Received Date (B2 EP Publication):

Translations Received Date (B3 EP Publication):

Publication date:

19/04/2017

EP B1 Publication Date:

19/04/2017

EP B2 Publication Date:

EP B3 Publication Date:

Lapsed date:

29/07/2017

Expiration date:

29/07/2033

Renunciation date:

Revocation date:

Annulment date:

Owner

From:

19/04/2017

 

 

Name:

Senju Metal Industry Co., Ltd

Address:

23 Senju-Hashido-cho Adachi-ku, Tokyo 120-8555, Japan (JP)

Inventor

1

Name:

FUJIMAKI, Rei

Address:

Japan (JP)

2

Name:

UESHIMA, Minoru

Address:

Japan (JP)

Priority

Priority Number:

2012178846

Priority Date:

10/08/2012

Priority Country:

Japan (JP)

Classification

IPC classification:

B23K 1/00; B23K 35/02; B23K 35/22; B23K 35/26; B23K 35/28; B23K 101/40; C22C 12/00; C22C 13/02; C22C 30/02; C22C 30/04; C22C 30/06; H05K 3/34;

Publication

European Patent Bulletin

Issue number:

201716

Publication date:

19/04/2017

Description:

Grant (B1)

Annual Fees

Annual Fee Due Date:

Annual Fee Number:

Expected Payer:

Last Annual Fee Payment Date:

Last Annual Fee Paid Number:

Payer:

Filing date	Document type	Number of pages
30/11/2017	Outgoing Correspondence	1